Kapton is a clear, amber colored polyimide film. The process for making Kapton heaters is similar to that of Etched Foil Silicone heaters. The desired circuit pattern is etched onto the bottom layer of Kapton then another layer of Kapton is added to the top to complete the heater. The result is a high-temperature flexible heating element with excellent dielectric properties capable of operating environments between -300°F (-185°C) and 392°F (200C).
Primary Features:
High tensile strength
Low outgassing
Excellent dimensional stability
Thin, lightweight profile
High watt densities
Transparent material
Kapton Heaters can easily be designed to accommodate a variety of components such as thermostats, thermal fuses, thermocouples, thermistors, RTDs, or specialty wiring harnesses. Typical applications for Kapton heaters include medical diagnostic instruments, LCDs, analytic test equipment and military equipment.
thermo's Kapton heaters have been safety tested and approved, and they are UL recognized under the UL file number E228871.
Kapton is a registered trademark of E.I. du Pont Nemours and Company.
Primary Features:
High tensile strength
Low outgassing
Excellent dimensional stability
Thin, lightweight profile
High watt densities
Transparent material
Kapton Heaters can easily be designed to accommodate a variety of components such as thermostats, thermal fuses, thermocouples, thermistors, RTDs, or specialty wiring harnesses. Typical applications for Kapton heaters include medical diagnostic instruments, LCDs, analytic test equipment and military equipment.
thermo's Kapton heaters have been safety tested and approved, and they are UL recognized under the UL file number E228871.
Kapton is a registered trademark of E.I. du Pont Nemours and Company.
Main Technique Index | ||
Description | Parameters | |
Polyimide | Polyester | |
Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
Copper Thickness (um) | 12,17.5,35,50,70,105 | |
Min. Line Width/Line Space (mm) | 0.075/0.075 | |
Min. Hole Size (mm) | 0.15 | |
Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
Solder Resistance | 260C 10 seconds | 204C 5 seconds |
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Surface Treatment | ||
Content | Normal coating thickness | Normal PNL size |
Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
OSP (In house) | N/A | 300mm×400 MM |
ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |