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Advantage:
1. Over 10 years' manufacturing experience
2. Assembly provided
3. 100% quality tested before shipment
4. Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
5. Our Products meet the RoHS & WEEE lead-free requirement.
6. Small Order accepted
7. 3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then
FPC Apply:
medical apparatus
automobiles
aerospace
industrial equipment
detecting instruments
smart-home controller
consumer electronics, etc
Xiamen Bolion Circuit Co., Ltd. Is established in Jan. 23, 2003. It owes 24, 000 sq. M of clean plant area, most advanced FPC manufacturing equipments and testing instruments. The monthly capacity is 16, 000sq. M of high-qualified Single-sided, Double-sided, Dual-access, Multilayer, Air-gap FPCs and Rigid-Flex PCBs, which are widely used in aerospace, automotive, medical devices, industrial control, consumer electronics, etc.
We a permanent member of CPCA (China Printed Circuit Association), a High and New Tech Enterprise of Xiamen City, one of Chinese top 100 PCB enterprises, one of Chinese top 10 innovative electronic components enterprises and won "national brand enterprises" in PCB China. We have passed ISO9001, TS16949, ISO14001 certificates. Series FPC and Rigid-flex boards are UL certificated and meet RoHS & WEEE environmental requirement (tested by SGS). Through good quality and best service, we enjoy good reputation in FPC field
We advocate "Integrity, Innovation, Harmony, Win-Win" enterprise spirits. With professional skills, advanced equipments, strict quality control, scientific management, reasonable prices and Law-abiding integrity of management ideal, we are dedicating to provide high-quality products and prompt service for customers.
Welcome to visit us and enjoy the success in business.
| Main Technique Index | ||
| Description | Parameters | |
| Polyimide | Polyester | |
| Base film Thickness (um) | 12.5,25,35,50 | 12.5,25,35,50 |
| Copper Thickness (um) | 12,17.5,35,50,70,105 | |
| Min. Line Width/Line Space (mm) | 0.075/0.075 | |
| Min. Hole Size (mm) | 0.15 | |
| Tolerance (mm) | Outline:+/-0.05; Coverlay: +/-0.2 | |
| Peel Strength (kgf/cm) | Above 1.0 | Above 0.8 |
| Solder Resistance | 260C 10 seconds | 204C 5 seconds |
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| Surface Treatment | ||
| Content | Normal coating thickness | Normal PNL size |
| Plating nickel gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating hard gold (In house) | Ni:2-9um;Au:0.1-1.0um | 300mm×400 MM |
| Plating soft gold (In house) | Ni:2-9um;Au:0.03-0.09um | 300mm×400 MM |
| Plating pure tin (In house) | 2.0-8.0um | 300mm×400 MM |
| Immersion Tin (In house) | 0.3-0.6um | 300mm×400 MM |
| OSP (In house) | N/A | 300mm×400 MM |
| ENIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENIG (Soft Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| ENEPIG (Hard Nickel) (In house) | Ni:2-6um;Au:0.03-0.10um | 300mm×400 MM |
| HASL (Outsource) | Cover the pads with min thickness 1~2 um | 300mm×400 MM |
| Immersion silver (Outsource) | Per standand creteria | 300mm×400 MM |